Heraeus' line of back-side pastes are especially formulated to provide high coverage for reduced usage on wafers. We continue to reduce the silver content of our back-side pastes, while also maintaining excellent adhesion to the silicon cell. With Pb- and Cd-free material options, Heraeus’ back-side pastes offer excellent solderability in both leaded and lead-free solders. All back-side pastes are co-fireable with back-side Al and front-side Ag pastes.
