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SOL109

Low Activity Silver Paste
SOL109 is a low activated silver paste for non ARC applications like Metal Wrap Through (MWT) solar cells. It provides all of the multiple requirements of a well designed via paste for direct contact areas of N-Type emitters. It works on mono and multicrystalline silicon wafers up to 90/sq. SOL109 can also be used for the p-solder pads, hence no extra printing step is necessary. SOL109 can be co-fired with commercially available back-side aluminum, silver/aluminum and Heraeus front-side silver conductors.
Key Benefits
  • Optimized rheology for reliable via printing
  • Low via hole resistance
  • Ultra-low shunting behavior
  • Cd free
  • No separate solder pad print
  • For high sheet emitter (≤ 90 ohms/sq.)
  • Excellent electrical and mechanical contact to commercially available front-side Ag pastes
Typical Properties
  • Vias: 50 – 120 μm diameter
  • Solid Content: 86.7 ± 1.5%
  • Viscosity:
    Cone and Plate Viscometer (Haake):
    17 – 23 Pas;
    Plate/cone (Ø = 20 mm, angle = 0.5°),
    @ 100 s-1, 25°C

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