Products

Heraeus’ line of front-side silver pastes are especially formulated to provide high efficiencies and wider processing windows, resulting in better yields and higher output for cell manufacturers. Our newest products, with lower silver content and higher cell coverage, provide customers with lower cost per watt.

Heraeus' line of back-side pastes are especially formulated to provide high coverage for reduced usage on wafers, while also maintaining excellent adhesion to the silicon cell. With Pb- and Cd-free material options, Heraeus’ back-side pastes offer excellent solderability in both leaded and no-lead solders.

With Heraeus' line of Metallization Pastes for Novel Cell Designs, customers can take advantage of Heraeus product innovations for technologies such as double printing, MWT, backside passivation, N-Type, bifacial and other new cell designs.